The Wakefield 126-4 thermal joint compound is a nontoxic, synthetic, ester-based (nonsilicone) with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. 126-4 thermal joint compound Solves the problems associated with contamination of wave solder baths and migration of silicone-based products. Shelf life: 5 years.
126 SERIES THERMAL JOINT COMPOUND
Characteristics Description
Appearance: Smooth, white homogeneous paste
Solids Content, wt %: 65% min
Thermal Conductivity at 36°C: .69 W / m 0K, 4.8 (Btu)(in.)/(hr) (ft2) (°F)
Interface Thermal Resistance: 0.043°C/W TO-3 at 0.0008 thick film
Bleed, 24 hrs at 200°C, wt%: 0.09% max
Evaporation, 24 hrs at 200°C, wt%: 0.6 max
Volume Resistivity: 2.3 x 1012 ohms-cm
Dielectric Strength: 200 volts/mil
Specific Gravity @ 60°F: 2.93 (gm/cc)
Penetration: 280 to 320
Operating Range: -40°C to 200°C
Safety Precautions: Comply with all local safety, disposal and transportation regulations and please check the Safety Data Sheet (SDS) and label of the individual products carefully before using the products. SDS’s are available on request.
Sizes stocked: please contact sales for availability.
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